Profile evolution of Cr masked features undergoing HBr-inductively coupled plasma etching for use in 25 nm silicon nanoimprint templates
- Olynick, Deirdre L.; Liddle, J. Alexander; Rangelow, Ivo W.
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Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 23, Issue 5
https://doi.org/10.1116/1.2050669
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journal
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January 2005 |
High resolution inductively coupled plasma etching of 30 nm lines and spaces in tungsten and silicon
- Goodyear, Andrew L.; Mackenzie, Sinclair; Olynick, Deirdre L.
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Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 18, Issue 6
https://doi.org/10.1116/1.1326922
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journal
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January 2000 |
Nanoscale pattern transfer for templates, NEMS, and nano-optics
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conference
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February 2007 |
Directed gas injection apparatus for semiconductor processing
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patent
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May 2007 |
Dependences of bottom and sidewall etch rates on bias voltage and source power during the etching of poly-Si and fluorocarbon polymer using SF[sub 6], C[sub 4]F[sub 8], and O[sub 2] plasmas
- Min, Jae-Ho; Lee, Gyeo-Re; Lee, Jin-kwan
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Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 22, Issue 3
https://doi.org/10.1116/1.1695338
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journal
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January 2004 |
Advanced time-multiplexed plasma etching of high aspect ratio silicon structures
- Blauw, M. A.; Craciun, G.; Sloof, W. G.
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Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 20, Issue 6
https://doi.org/10.1116/1.1518018
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journal
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January 2002 |
Selective anisotropic reactive ion etching process for polysilicide composite structures
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patent
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July 1985 |
Investigation of fluorocarbon plasma deposition from c‐C4F8 for use as passivation during deep silicon etching
- Labelle, Catherine B.; Donnelly, Vincent M.; Bogart, Gregory R.
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Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 22, Issue 6
https://doi.org/10.1116/1.1810165
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journal
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November 2004 |
Investigation of in situ trench etching process and Bosch process for fabricating high-aspect-ratio beams for microelectromechanical systems
- Kok, Kitt Wai; Yoo, Won Jong; Sooriakumar, K.
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Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 20, Issue 5
https://doi.org/10.1116/1.1501583
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journal
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January 2002 |
Dry etching with gas chopping without rippled sidewalls
- Volland, B.; Shi, F.; Hudek, P.
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Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 17, Issue 6
https://doi.org/10.1116/1.591061
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journal
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January 1999 |
Method of anisotropically etching silicon
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patent
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March 1996 |
Absolute intensities of the vacuum ultraviolet spectra in a metal-etch plasma processing discharge
- Woodworth, J. R.; Blain, M. G.; Jarecki, R. L.
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Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 17, Issue 6
https://doi.org/10.1116/1.582044
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journal
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November 1999 |
Profile simulation of gas chopping based etching processes
- Volland, B. E.; Ivanov, Tzv.; Rangelow, I. W.
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Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 20, Issue 6
https://doi.org/10.1116/1.1520572
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journal
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January 2002 |
The Electron Charging Effects of Plasma on Notch Profile Defects
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journal
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April 1995 |
Critical tasks in high aspect ratio silicon dry etching for microelectromechanical systems
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journal
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July 2003 |
Substrate cooling efficiency during cryogenic inductively coupled plasma polymer etching for diffractive optics on membranes
- Olynick, Deirdre L.; Anderson, Erik H.; Harteneck, Bruce
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Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 19, Issue 6
https://doi.org/10.1116/1.1414021
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journal
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January 2001 |