Printed circuit board impedance matching step for microwave (millimeter wave) devices
An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices. A method of constructing microwave and other high frequency electrical circuits on a substrate of uniform thickness, where the circuit is formed of a plurality of interconnected elements of different impedances that individually require substrates of different thicknesses, by providing a substrate of uniform thickness that is a composite or multilayered substrate; and forming a pattern of intermediate ground planes or impedance matching steps interconnected by vias located under various parts of the circuit where components of different impedances are located so that each part of the circuit has a ground plane substrate thickness that is optimum while the entire circuit is formed on a substrate of uniform thickness.
- Research Organization:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC52-07NA27344
- Assignee:
- Lawrence Livermore National Security, LLC. (Livermore, CA); Kyocera America, Inc. (San Diego, CA)
- Patent Number(s):
- 8,547,187
- Application Number:
- 12/895,347
- OSTI ID:
- 1107573
- Country of Publication:
- United States
- Language:
- English
Microstrip patch antenna with fractal structure
|
patent | October 2000 |
Constant impedance transition between transmission structures of different dimensions
|
patent | February 1993 |
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