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Title: Vertically Integrated Circuits at Fermilab

The exploration of the vertically integrated circuits, also commonly known as 3D-IC technology, for applications in radiation detection started at Fermilab in 2006. This paper examines the opportunities that vertical integration offers by looking at various 3D designs that have been completed by Fermilab. The emphasis is on opportunities that are presented by through silicon vias (TSV), wafer and circuit thinning and finally fusion bonding techniques to replace conventional bump bonding. Early work by Fermilab has led to an international consortium for the development of 3D-IC circuits for High Energy Physics. The consortium has submitted over 25 different designs for the Fermilab organized MPW run organized for the first time.
Authors:
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Publication Date:
OSTI Identifier:
971385
Report Number(s):
FERMILAB-CONF-09-596-PPD
TRN: US1001180
DOE Contract Number:
AC02-07CH11359
Resource Type:
Conference
Resource Relation:
Conference: Presented at 2009 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS MIC 2009), Orlando, Florida , 25-31 Oct 2009
Research Org:
Fermi National Accelerator Laboratory (FNAL), Batavia, IL
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY; BONDING; EXPLORATION; FERMILAB; HIGH ENERGY PHYSICS; INTEGRATED CIRCUITS; RADIATION DETECTION; SILICON; VERTICAL INTEGRATION Instrumentation