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Title: Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature. This paper presents an overview of the principal results obtained from X-ray microdiffraction studies of electromigration effects on aluminum and copper interconnects at the ALS throughout continuous efforts that spanned over a decade (1998-2008) from approximately 40 weeks of combined beamtime.
Authors:
; ;
Publication Date:
OSTI Identifier:
961530
Report Number(s):
LBNL-1955E
TRN: US1004015
DOE Contract Number:
DE-AC02-05CH11231
Resource Type:
Conference
Resource Relation:
Conference: 10th International Workshop on Stress-Induced Phenomena in Metallization, Austin, TX, November 5-7, 2008
Research Org:
Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
Sponsoring Org:
Advanced Light Source Division
Country of Publication:
United States
Language:
English
Subject:
36; ADVANCED LIGHT SOURCE; ALUMINIUM; COPPER; DENSITY; DIFFUSION; DISLOCATIONS; ELECTROPHORESIS; GRAIN ORIENTATION; METALS; MONITORING; PLASTICITY; SENSITIVITY; SPATIAL RESOLUTION; STRAINS; SYNCHROTRONS; Electromigration X-ray microdiffraction stress/strain interconnects