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Title: Advanced modeling and simulation to design and manufacture high performance and reliable advanced microelectronics and microsystems.

An interdisciplinary team of scientists and engineers having broad expertise in materials processing and properties, materials characterization, and computational mechanics was assembled to develop science-based modeling/simulation technology to design and reproducibly manufacture high performance and reliable, complex microelectronics and microsystems. The team's efforts focused on defining and developing a science-based infrastructure to enable predictive compaction, sintering, stress, and thermomechanical modeling in ''real systems'', including: (1) developing techniques to and determining materials properties and constitutive behavior required for modeling; (2) developing new, improved/updated models and modeling capabilities, (3) ensuring that models are representative of the physical phenomena being simulated; and (4) assessing existing modeling capabilities to identify advances necessary to facilitate the practical application of Sandia's predictive modeling technology.
 [1] ; ; ; ;  [2] ; ; ; ; ;  [3]
  1. (University of Pittsburgh, Pittsburgh, PA)
  2. (,
  3. (Pennsylvania State University, University Park, PA)
Publication Date:
OSTI Identifier:
Report Number(s):
TRN: US200802%%383
DOE Contract Number:
Resource Type:
Technical Report
Research Org:
Sandia National Laboratories
Sponsoring Org:
Country of Publication:
United States
42 ENGINEERING; COMPUTER-AIDED DESIGN; MICROELECTRONICS; PERFORMANCE; COMPUTERIZED SIMULATION; MANUFACTURING; MATHEMATICAL MODELS Integrated circuits-Materials-Thermomechanical properties.; Materials.; Simulation and Modeling; Microelectronics-Materials-Research.