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Title: Method of making thermally removable epoxies

A method of making a thermally-removable epoxy by mixing a bis(maleimide) compound to a monomeric furan compound containing an oxirane group to form a di-epoxy mixture and then adding a curing agent at temperatures from approximately room temperature to less than approximately 90.degree. C. to form a thermally-removable epoxy. The thermally-removable epoxy can be easily removed within approximately an hour by heating to temperatures greater than approximately 90.degree. C. in a polar solvent. The epoxy material can be used in protecting electronic components that may require subsequent removal of the solid material for component repair, modification or quality control.
Authors:
 [1] ;  [1] ;  [2] ;  [1] ;  [3]
  1. (Albuquerque, NM)
  2. (Rio Rancho, NM)
  3. (late of Albuquerque, NM)
Publication Date:
OSTI Identifier:
874198
Report Number(s):
US 6337384
DOE Contract Number:
AC04-94AL85000
Resource Type:
Patent
Research Org:
SANDIA CORP
Country of Publication:
United States
Language:
English
Subject:
method; thermally; removable; epoxies; method; thermally-removable; epoxy; mixing; bismaleimide; compound; monomeric; furan; compound; containing; oxirane; form; di-epoxy; mixture; adding; curing; agent; temperatures; approximately; temperature; approximately; 90degree; form; thermally-removable; epoxy; thermally-removable; epoxy; easily; removed; approximately; hour; heating; temperatures; approximately; 90degree; polar; solvent; epoxy; material; protecting; electronic; components; require; subsequent; removal; solid; material; component; repair; modification; quality; control; solid material; easily removed; curing agent /528/521/523/525/