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Title: Method of making thermally removable polymeric encapsulants

A method of making a thermally-removable encapsulant by heating a mixture of at least one bis(maleimide) compound and at least one monomeric tris(furan) or tetrakis(furan) compound at temperatures from above room temperature to less than approximately 90.degree. C. to form a gel and cooling the gel to form the thermally-removable encapsulant. The encapsulant can be easily removed within approximately an hour by heating to temperatures greater than approximately 90.degree. C., preferably in a polar solvent. The encapsulant can be used in protecting electronic components that may require subsequent removal of the encapsulant for component repair, modification or quality control.
Authors:
 [1] ;  [2] ;  [2] ;  [2] ;  [3]
  1. (Santa Fe, NM)
  2. (Albuquerque, NM)
  3. (late of Albuquerque, NM)
Publication Date:
OSTI Identifier:
873916
Report Number(s):
US 6271335
DOE Contract Number:
AC04-94AL85000
Resource Type:
Patent
Research Org:
SANDIA CORP
Country of Publication:
United States
Language:
English
Subject:
method; thermally; removable; polymeric; encapsulants; method; thermally-removable; encapsulant; heating; mixture; bis; maleimide; compound; monomeric; tris; furan; tetrakis; furan; compound; temperatures; temperature; approximately; 90; degree; form; cooling; form; thermally-removable; encapsulant; encapsulant; easily; removed; approximately; hour; heating; temperatures; approximately; 90; degree; preferably; polar; solvent; encapsulant; protecting; electronic; components; require; subsequent; removal; encapsulant; component; repair; modification; quality; control; polar solvent; easily removed; electronic components; subsequent removal /528/264/525/