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Title: Epoxy bond and stop etch fabrication method

A class of epoxy bond and stop etch (EBASE) microelectronic fabrication techniques is disclosed. The essence of such techniques is to grow circuit components on top of a stop etch layer grown on a first substrate. The first substrate and a host substrate are then bonded together so that the circuit components are attached to the host substrate by the bonding agent. The first substrate is then removed, e.g., by a chemical or physical etching process to which the stop etch layer is resistant. EBASE fabrication methods allow access to regions of a device structure which are usually blocked by the presence of a substrate, and are of particular utility in the fabrication of ultrafast electronic and optoelectronic devices and circuits.
Authors:
 [1] ;  [2] ;  [3]
  1. (Sandia Park, NM)
  2. (Pleasanton, CA)
  3. (Albuquerque, NM)
Publication Date:
OSTI Identifier:
873192
Report Number(s):
US 6110393
DOE Contract Number:
AC04-94AL85000
Resource Type:
Patent
Research Org:
SANDIA CORP
Country of Publication:
United States
Language:
English
Subject:
epoxy; bond; stop; etch; fabrication; method; epoxy; bond; stop; etch; ebase; microelectronic; fabrication; techniques; disclosed; essence; techniques; grow; circuit; components; top; stop; etch; layer; grown; substrate; substrate; host; substrate; bonded; circuit; components; attached; host; substrate; bonding; agent; substrate; removed; chemical; physical; etching; process; stop; etch; layer; resistant; ebase; fabrication; methods; allow; access; regions; device; structure; blocked; presence; substrate; particular; utility; fabrication; ultrafast; electronic; optoelectronic; devices; circuits; circuit component; circuit component; microelectronic fabrication; stop etch; stop etch; stop etch; stop etch; fabrication method; fabrication method; bonding agent; etching process; electronic devices; circuit components; circuit components; fabrication techniques; particular utility; allow access; electronic device; fabrication methods; epoxy bond; epoxy bond; optoelectronic device; layer grown /216/204/438/