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Title: Epoxy bond and stop etch fabrication method

A class of epoxy bond and stop etch (EBASE) microelectronic fabrication techniques is disclosed. The essence of such techniques is to grow circuit components on top of a stop etch layer grown on a first substrate. The first substrate and a host substrate are then bonded together so that the circuit components are attached to the host substrate by the bonding agent. The first substrate is then removed, e.g., by a chemical or physical etching process to which the stop etch layer is resistant. EBASE fabrication methods allow access to regions of a device structure which are usually blocked by the presence of a substrate, and are of particular utility in the fabrication of ultrafast electronic and optoelectronic devices and circuits.
 [1] ;  [2] ;  [3]
  1. (Sandia Park, NM)
  2. (Pleasanton, CA)
  3. (Albuquerque, NM)
Publication Date:
OSTI Identifier:
Report Number(s):
US 6110393
DOE Contract Number:
Resource Type:
Research Org:
Country of Publication:
United States
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