skip to main content

Title: Load regulating expansion fixture

A free standing self contained device for bonding ultra thin metallic films, such as 0.001 inch beryllium foils. The device will regulate to a predetermined load for solid state bonding when heated to a bonding temperature. The device includes a load regulating feature, whereby the expansion stresses generated for bonding are regulated and self adjusting. The load regulator comprises a pair of friction isolators with a plurality of annealed copper members located therebetween. The device, with the load regulator, will adjust to and maintain a stress level needed to successfully and economically complete a leak tight bond without damaging thin foils or other delicate components.
Authors:
 [1] ;  [1]
  1. (San Jose, CA)
Publication Date:
OSTI Identifier:
872037
Report Number(s):
US 5848746
DOE Contract Number:
W-7405-ENG-48
Resource Type:
Patent
Research Org:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA
Country of Publication:
United States
Language:
English
Subject:
load; regulating; expansion; fixture; free; standing; contained; device; bonding; ultra; metallic; films; 001; inch; beryllium; foils; device; regulate; predetermined; load; solid; bonding; heated; bonding; temperature; device; load; regulating; feature; whereby; expansion; stresses; generated; bonding; regulated; adjusting; load; regulator; comprises; pair; friction; isolators; plurality; annealed; copper; located; therebetween; device; load; regulator; adjust; maintain; stress; level; successfully; economically; complete; leak; tight; bond; damaging; foils; delicate; components; free standing; stresses generated; bonding temperature; annealed copper; leak tight; located therebetween; stress level; metallic film; expansion stresses /228/