Chemical vapor deposition for microelectronics: Principles, technology, and applications
This book presents study of chemical vapor deposition (CVD). CVD is an inherently interdisciplinary field. Its understanding requires knowledge of fluid mechanics, plasma physics, chemical thermodynamics and kinetics, as well as homogeneous and heterogenous chemical reactions. The newest developments in this rapidly changing field are described. After the basics of thermal and plasma-enhanced chemical vapor deposition are covered in the first two chapters, the next three chapters deal with the many diverse films used in semiconductor fabrication that can be deposited by this technique. Because of the importance of commercially-viable reactors for film deposition, many well-known and widely-used deposition systems are described. Finally, the physical and chemical nature of these films is analyzed.
- OSTI ID:
- 7247367
- Country of Publication:
- United States
- Language:
- English
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SUPERCONDUCTIVITY AND SUPERFLUIDITY
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
36 MATERIALS SCIENCE
42 ENGINEERING
CHEMICAL VAPOR DEPOSITION
FLUID MECHANICS
TECHNOLOGY ASSESSMENT
THIN FILMS
CHEMICAL PROPERTIES
FABRICATION
MICROELECTRONICS
PHYSICAL PROPERTIES
CHEMICAL REACTIONS
REVIEWS
SEMICONDUCTOR DEVICES
THERMODYNAMICS
USES
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DEPOSITION
DOCUMENT TYPES
FILMS
MECHANICS
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360601 - Other Materials- Preparation & Manufacture
420800 - Engineering- Electronic Circuits & Devices- (-1989)