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Title: Investigation of reliability attributes and accelerated stress factors of terrestrial solar cells. 1981 summary report

Technical Report ·
DOI:https://doi.org/10.2172/7012391· OSTI ID:7012391

Reported is a program to investigate the reliability attributes of terrestrial solar cells. The accelerated stress test results obtained on all cells since the inception of the program are summarized, as well as specific results obtained during the fourth year's effort. Tested cells were grouped according to the method used to form the conductive metallization layer: solder dipped, vacuum deposited, screen printed, and copper plated. Although metallization systems within each group were quite similar, they differed in numerous details according to the procedures employed by each manufacturer. Test results were summarized for all cells according to both electrical degradation and catastrophic mechanical changes. These results indicated a variability within each metallization category which was dependent on the manufacturer. Only one manufacturer was represented in the copper plated category and, although these showed no signs of detrimental copper diffusion during high temperature testing, their metallization was removed easily during high humidity pressure cooker testing. Preliminary testing of encapsulated cells showed no major differences between encapsulated and unencapsulated cells when subjected to accelerated testing. While further work must be performed, this seems to indicate the major role of encapsulation to be mechanical protection. An overview is given of the data collection and analysis procedures developed on the contract.

Research Organization:
Clemson Univ., SC (USA). Dept. of Electrical and Computer Engineering
DOE Contract Number:
NAS-7-100-954929
OSTI ID:
7012391
Report Number(s):
DOE/JPL/954929-82/9; ON: DE82019860
Country of Publication:
United States
Language:
English