Kinetics and mechanism of high-temperature oxidation of copper covered by bismuth thin films

Journal Article · Thu Oct 01 00:00:00 EDT 1992 · Oxidation of Metals; (United States)

DOI:https://doi.org/10.1007/BF00666916· OSTI ID:6906979

Belousov, V V ^[1]

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1. Chelyabinsk State Univ. (Russian Federation)

The oxidation kinetics of copper covered by thin films of bismuth were studied by TGA, X-ray diffraction, X-ray micro-elemental, coulombmetric methods, and by electron and optional microscopy. At 1,003 K catastrophic oxidation of copper coated by bismuth thin films was observed. The parabolic rate constant of copper oxidation (Kp) depends markedly on the thickness of the bismuth film and is more than 1,000 times greater than that of bare copper. The mechanism of catastrophic copper oxidation in contact with bismuth is discussed.

• OSTI ID: 6906979
• Journal Information: Oxidation of Metals; (United States), Vol. 38:3-4; ISSN 0030-770X
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
BISMUTH
METALLURGICAL EFFECTS
COPPER
OXIDATION
BISMUTH CARBONATES
BISMUTH OXIDES
CHEMICAL REACTION KINETICS
COPPER OXIDES
ELECTRON MICROSCOPY
MICROSTRUCTURE
OPTICAL MICROSCOPY
PHASE STUDIES
TEMPERATURE RANGE 1000-4000 K
THERMAL GRAVIMETRIC ANALYSIS
THIN FILMS
X-RAY DIFFRACTION
BISMUTH COMPOUNDS
CARBON COMPOUNDS
CARBONATES
CHALCOGENIDES
CHEMICAL ANALYSIS
CHEMICAL REACTIONS
COHERENT SCATTERING
COPPER COMPOUNDS
CRYSTAL STRUCTURE
DIFFRACTION
ELEMENTS
FILMS
GRAVIMETRIC ANALYSIS
KINETICS
METALS
MICROSCOPY
OXIDES
OXYGEN COMPOUNDS
QUANTITATIVE CHEMICAL ANALYSIS
REACTION KINETICS
SCATTERING
TEMPERATURE RANGE
THERMAL ANALYSIS
TRANSITION ELEMENT COMPOUNDS
TRANSITION ELEMENTS
360105* - Metals & Alloys- Corrosion & Erosion