An experimental study of laminar film condensation with Stefan number greater than unity
- AT and T Bell Labs., Princeton, NJ (USA)
- Sandia National Labs., Albuquerque, NM (USA)
Experimental laminar condensation heat transfer data is reported for fluids with Stefan number up to 3.5. The fluid is a member of a family of fluorinated fluids developed in the last decade which have been extensively used in the electronics industry for soldering, cooling, and testing applications. Experiments were performed by suddenly immersing cold copper spheres in the saturated vapor of this fluid, and heat transfer rates were calculated using the quasi-steady temperature response of the spheres. In these experiments, the difference between saturation and wall temperature varied from 0.5{degree}C to 190{degree}C. Over this range of temperature difference, the condensate properties vary significantly. For example, viscosity of the condense varies by a factor of over 50. Corrections for the temperature dependent properties of the condensate therefore were incorporated in calculating the Nusselt number based on the average heat transfer coefficient. The results are discussed in light of past experimental data theory for Stefan number less than 1. To the knowledge of the authors, this is the first reported study of condensation heat transfer for Stefan number greater that unity. 24 refs., 7 figs., 2 tabs.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- DOE/DP
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 6878529
- Report Number(s):
- SAND-90-0878C; CONF-900619-5; ON: DE90013240
- Resource Relation:
- Journal Volume: 113; Journal Issue: 2; Conference: 5. AIAA/ASME thermal physics and heat transfer conference, Seattle, WA (USA), 18-20 Jun 1990
- Country of Publication:
- United States
- Language:
- English
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HEAT TRANSFER FLUIDS
LAMINAR FLOW
EQUATIONS
FLUORINATION
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NUSSELT NUMBER
PHYSICAL PROPERTIES
VISCOSITY
CHEMICAL REACTIONS
ENERGY TRANSFER
FLUID FLOW
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HALOGENATION
420400* - Engineering- Heat Transfer & Fluid Flow
426000 - Engineering- Components
Electron Devices & Circuits- (1990-)