The role of vacuum bakeout and uv-ozone cleaning in the sealing of IC packages
Conference
·
OSTI ID:6665221
Low production yields were being experienced at an integrated circuit packaging lab operated jointly by the Allied-Signal Albuquerque Microelectronic Operation and the Packaging Technology Division of Sandia National Laboratories. It was suspected that organic contamination of the sealing surfaces was causing the low yields. These low yields were not only undesirable, but also raised questions about the quality of the parts that did pass the yield tests. The reliability of these parts was therefore questionable and efforts were taken to improve both the yield and the quality of the hermetic sealing operation.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (USA)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 6665221
- Report Number(s):
- SAND-88-3035C; CONF-8810159-3; ON: DE89003237
- Resource Relation:
- Conference: 3. inter-agency cleaning and contamination control seminar, Kansas City, MO, USA, 18 Oct 1988; Other Information: Portions of this document are illegible in microfiche products
- Country of Publication:
- United States
- Language:
- English
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