Low-temperature curing of a nitrile-epoxy adhesive. Final report
Adhesive strength and glass transition temperature were correlated with cure times at 85/sup 0/C and above. The effect of moisture on adhesive cure and strength was tested. With a 3-hour cure at 85/sup 0/C, lap shear strength met specification requirements. The adhesive was found to absorb moisture with time, especially if one or both polyethylene covers are removed. Placing the adhesive in a desiccator for 30 minutes produced excellent room temperature shear strengths. Preconditioning (removal of moisture) is critical for elevated temperature cures.
- Publication Date:
- OSTI Identifier:
- Report Number(s):
- DOE Contract Number:
- Resource Type:
- Technical Report
- Research Org:
- Bendix Corp., Kansas City, MO (USA)
- Country of Publication:
- United States
- 36 MATERIALS SCIENCE; ADHESIVES; CURING; DEGASSING; EPOXIDES; FILMS; GLASS; MOISTURE; NITRILES; PHASE TRANSFORMATIONS; SHEAR PROPERTIES; MECHANICAL PROPERTIES; ORGANIC COMPOUNDS; ORGANIC NITROGEN COMPOUNDS; ORGANIC OXYGEN COMPOUNDS 360600* -- Other Materials
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