Statistical analysis of data from the solderability testing of electroless nickel plated Kovar leads

Technical Report · Wed Jan 01 00:00:00 EST 1986

OSTI ID:6192006

Fisher, R E; Hall, I J

Many Sandia National Laboratories components require electrical leads to be soldered to an assembly such as a printed wiring board. In late 1982, a supplier reported to Sandia that they had problems soldering leads of a 14/16 pin integrated circuit flatpack to printed wiring boards. These problems led to the investigation described herein of the fluxes used in solder-dipping. This study shows that Alpha 611 flux, used by the supplier, is not active enough to wet an electroless nickel-plated surface that has been exposed to 200C for 16 hours (which is a condition seen in production prior to soldering). Two Blackstone fluxes included in the study did provide uniform wetting in this situation and also for room temperature curing, even though the time in flux ranged from .25 to 10 minutes. Blackstone 642 flux had a higher wetting rate and lower contact angle than Blackstone 2508. However, Flux residues of B-642 contain chloride ions; therefore, B-2508 has now been adopted by the supplier.

• Research Organization: Sandia National Labs., Albuquerque, NM (USA)
• DOE Contract Number: AC04-76DP00789
• OSTI ID: 6192006
• Report Number(s): SAND-85-1103; ON: DE86005970
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
ELECTRIC CONTACTS
SOLDERING
KOVAR
PRINTED CIRCUITS
METALLURGICAL FLUX
NICKEL
ALLOYS
COBALT ALLOYS
ELECTRICAL EQUIPMENT
ELECTRONIC CIRCUITS
ELEMENTS
EQUIPMENT
FABRICATION
IRON ALLOYS
IRON BASE ALLOYS
JOINING
MANGANESE ADDITIONS
MANGANESE ALLOYS
METALS
NICKEL ALLOYS
TRANSITION ELEMENTS
WELDING
420800* - Engineering- Electronic Circuits & Devices- (-1989)