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Title: Epoxy Foam Encapsulants: Processing and Dielectric Characterization

The dielectric performance of epoxy foams was investigated to determine if such materials might provide advantages over more standard polyurethane foams in the encapsulation of electronic assemblies. Comparisons of the dielectric characteristics of epoxy and urethane encapsulant foams found no significant differences between the two resin types and no significant difference between as-molded and machined foams. This study specifically evaluated the formulation and processing of epoxy foams using simple methylhydrosiloxanes as the flowing agent and compared the dielectric performance of those to urethane foams of similar density.
Authors:
;
Publication Date:
OSTI Identifier:
5988
Report Number(s):
SAND99-8213
TRN: AH200115%%355
Resource Type:
Technical Report
Resource Relation:
Other Information: PBD: 1 Jan 1999
Research Org:
Sandia National Labs., Albuquerque, NM (US); Sandia National Labs., Livermore, CA (US)
Sponsoring Org:
US Department of Energy (US)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; DIELECTRIC MATERIALS; ENCAPSULATION; PERFORMANCE; POLYURETHANES; RESINS; URETHANE