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Title: ISTFA 1986 - International Symposium for Testing and Failure Analysis; Proceedings of the Symposium, Los Angeles, CA, Oct. 20-24, 1986

Abstract

The conference presents papers on the analysis of electronic materials, problems with electronic materials, EOS/ESD, new techniques, failure analysis results, test methods, failure modes and mechanisms, and the effect of microstructure on properties. Topics include the analysis of on-line organic microcontaminants in semiconductor assembly plants, the role of surface chemistry in packaging failures, the testing and analysis of photovoltaic modules for electrochemical corrosion, the reliability improvement and evaluation of TWTs for communications satellites, and the analysis of adhesive bond joint fractures by scanning electron fractography and X-ray emission spectroscopy. Consideration is also given to observers for failure detection of actuation systems, mechanisms governing the high strain fracture behavior of Al-Li-X alloys, and the effect of nonmetallic inclusions and test temperature on the fatigue life of cast C355, 354, and A206 aluminum.

Publication Date:
OSTI Identifier:
5678996
Report Number(s):
CONF-8610383-
Resource Type:
Conference
Resource Relation:
Conference: International symposium for testing and failure analysis, Los Angeles, CA, USA, 20 Oct 1986
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 36 MATERIALS SCIENCE; FAILURES; MEETINGS; ALUMINIUM ALLOYS; AMBIENT TEMPERATURE; COMPOSITE MATERIALS; ELASTICITY; ELECTROCHEMICAL CORROSION; FATIGUE; FRACTURE MECHANICS; LEADING ABSTRACT; MECHANICAL ENGINEERING; MICROELECTRONICS; MICROSTRUCTURE; TEMPERATURE DEPENDENCE; TESTING; USES; ABSTRACTS; ALLOYS; CHEMICAL REACTIONS; CORROSION; CRYSTAL STRUCTURE; DOCUMENT TYPES; ENGINEERING; MATERIALS; MECHANICAL PROPERTIES; MECHANICS; TENSILE PROPERTIES; 420200* - Engineering- Facilities, Equipment, & Techniques; 420800 - Engineering- Electronic Circuits & Devices- (-1989); 360000 - Materials

Citation Formats

. ISTFA 1986 - International Symposium for Testing and Failure Analysis; Proceedings of the Symposium, Los Angeles, CA, Oct. 20-24, 1986. United States: N. p., 1986. Web.
. ISTFA 1986 - International Symposium for Testing and Failure Analysis; Proceedings of the Symposium, Los Angeles, CA, Oct. 20-24, 1986. United States.
. 1986. "ISTFA 1986 - International Symposium for Testing and Failure Analysis; Proceedings of the Symposium, Los Angeles, CA, Oct. 20-24, 1986". United States.
@article{osti_5678996,
title = {ISTFA 1986 - International Symposium for Testing and Failure Analysis; Proceedings of the Symposium, Los Angeles, CA, Oct. 20-24, 1986},
author = {},
abstractNote = {The conference presents papers on the analysis of electronic materials, problems with electronic materials, EOS/ESD, new techniques, failure analysis results, test methods, failure modes and mechanisms, and the effect of microstructure on properties. Topics include the analysis of on-line organic microcontaminants in semiconductor assembly plants, the role of surface chemistry in packaging failures, the testing and analysis of photovoltaic modules for electrochemical corrosion, the reliability improvement and evaluation of TWTs for communications satellites, and the analysis of adhesive bond joint fractures by scanning electron fractography and X-ray emission spectroscopy. Consideration is also given to observers for failure detection of actuation systems, mechanisms governing the high strain fracture behavior of Al-Li-X alloys, and the effect of nonmetallic inclusions and test temperature on the fatigue life of cast C355, 354, and A206 aluminum.},
doi = {},
url = {https://www.osti.gov/biblio/5678996}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Jan 01 00:00:00 EST 1986},
month = {Wed Jan 01 00:00:00 EST 1986}
}

Conference:
Other availability
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