Apparatus for and method of controlling sputter coating

Patent · Tue Feb 19 00:00:00 EST 1985

OSTI ID:5441485

Boys, R

The magnetic field of a magnetron sputter coating apparatus is controlled in response to measurements of plasma parameters to control deposition parameters, such as sputter deposition rate and material deposition thickness profile. From time to time the apparatus is standardized to change preset values for parameters of the plasma to manage the deposition parameters.

• Assignee: Varian Associates, Inc.
• Patent Number(s): US 4500408
• Application Number: TRN: 85-020361
• OSTI ID: 5441485
• Resource Relation: Patent File Date: Filed date 27 Dec 1983; Other Information: PAT-APPL-564776
• Country of Publication: United States
• Language: English

Related Subjects

47 OTHER INSTRUMENTATION
CATHODE SPUTTERING
MAGNETRONS
VACUUM COATING
FLOWMETERS
MAGNET COILS
PULSE GENERATORS
VACUUM PUMPS
DEPOSITION
ELECTRIC COILS
ELECTRICAL EQUIPMENT
ELECTRON TUBES
ELECTRONIC EQUIPMENT
EQUIPMENT
FUNCTION GENERATORS
LABORATORY EQUIPMENT
MEASURING INSTRUMENTS
METERS
MICROWAVE EQUIPMENT
MICROWAVE TUBES
PUMPS
SPUTTERING
SURFACE COATING
440300* - Miscellaneous Instruments- (-1989)