Electrically conductive articles and processes for their fabrication

Patent · Tue Jan 29 00:00:00 EST 1991

OSTI ID:5158016

Mir, J M; Hung, L S

This patent describes a electrically conductive articles and processes for their fabrication. They comprise a refractory substrate, a flexible electrically conductive crystalline cuprate layer, a release layer interposed between the flexible conductive cuprate layer and the substrate, the release layer being comprised of at least on of the metals of groups 8 to 11 and periods 5 and 6 of the periodic table of elements, a flexible organic film, and means for adhesively bonding the flexible organic film to the flexible conductive cuprate layer, so that the release layer, the flexible conductive cuprate layer, the adhesive bonding means and the flexible organic film can be stripped from the refractory substrate to form a flexible electrically conductive article.

• Assignee: Eastman Kodak Co., Rochester, NY (USA)
• Patent Number(s): US 4988674; A
• Application Number: PPN: US 7-308297
• OSTI ID: 5158016
• Resource Relation: Patent File Date: 9 Feb 1989
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ORGANIC SUPERCONDUCTORS
FABRICATION
ADHESION
CHEMICAL COMPOSITION
COPPER
CUPRATES
REFRACTORIES
SUBSTRATES
SUPERCONDUCTORS
COPPER COMPOUNDS
ELEMENTS
METALS
OXYGEN COMPOUNDS
TRANSITION ELEMENT COMPOUNDS
TRANSITION ELEMENTS
360201* - Ceramics
Cermets
& Refractories- Preparation & Fabrication