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Title: On-clip high frequency reliability and failure test structures

Self-stressing test structures for realistic high frequency reliability characterizations. An on-chip high frequency oscillator, controlled by DC signals from off-chip, provides a range of high frequency pulses to test structures. The test structures provide information with regard to a variety of reliability failure mechanisms, including hot-carriers, electromigration, and oxide breakdown. The system is normally integrated at the wafer level to predict the failure mechanisms of the production integrated circuits on the same wafer. 22 figs.
Authors:
;
Publication Date:
OSTI Identifier:
504963
Report Number(s):
US 5,625,288/A/
PAN: US patent application 8-590,690
DOE Contract Number:
AC04-76DP00789
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 29 Apr 1997
Research Org:
AT&T Corporation
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; INTEGRATED CIRCUITS; RELIABILITY; PERFORMANCE TESTING; OSCILLATORS; FAILURES