Interfacial reactions between sapphire and silver-copper-titanium thin film filler metal

Journal Article · Sat Feb 01 00:00:00 EST 1997 · Journal of the American Ceramic Society

DOI:https://doi.org/10.1111/j.1151-2916.1997.tb02849.x· OSTI ID:483668

Suenaga, Seiichi; Nakahashi, Masako; Maruyama, Miho; Fukasawa, Takayuki ^[1]

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1. Toshiba Corp., Kanagawa (Japan). Materials and Devices Research Labs.

Wetting and brazing studies of sputtering-deposited, submicrometer thin film filler metal in an Ag-Cu-Ti/Al{sub 2}O{sub 3} system were performed. The interfacial reaction layer between the filler metal and Al{sub 2}O{sub 3} was investigated. It is possible to make a brazing joint even with a reaction layer of less than 100 nm thickness. Different types of interfacial reaction layers were observed when the Ti content in the filler metal was varied. The Cu-Ti-O system compounds were observed in the samples with high wetting capabilities, but not in the sample with low wetting characteristics. It was found that these compounds are substances that promote effective brazing.

• Sponsoring Organization: USDOE
• OSTI ID: 483668
• Journal Information: Journal of the American Ceramic Society, Vol. 80, Issue 2; Other Information: PBD: Feb 1997
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
BRAZING
WETTABILITY
SAPPHIRE
SILVER ALLOYS
COPPER ALLOYS
TITANIUM
COMPOSITE MATERIALS
THIN FILMS
SPUTTERING
HEAT TREATMENTS
INTERFACES
CHEMICAL REACTIONS
BONDING