The improvement of mechanical properties of aluminum nitride and alumina by 1 keV Ar{sup +} ion irradiation in reactive gas environment
- Korea Inst. of Science and Technology, Seoul (Korea, Republic of). Div. of Ceramics
Ar ions with 1 keV energy was irradiated on aluminum nitride in an O{sub 2} environment to increase the bonding strength with Cu and also on alumina in an N{sub 2} environment to increase the bending strength. Cu(1,000 {angstrom}) films were deposited by ion-beam sputter on Ar{sup +} irradiated/unirradiated AlN surfaces and the change of the bond strength was investigated by a scratch test. For the study of chemical structural change don the Ar{sup +} irradiated AlN surface. Cu(50{angstrom}) were deposited on an AlN substrate and XPS depth profile analysis was performed. Cu films deposited on Ar{sup +} irradiated AlN under an O{sub 2} environment showed the bond strength of 30 Newton by a scratch test. On the basis of Cu3p, Al2p near core levels and O1s, N1s core level spectra, it was found that the improvement of bond strength of Cu films on the AlN surface resulted from the formation of intermediate layers such as copper oxide and aluminum oxynitride. The bending strength of polycrystalline alumina irradiated by Ar ions in an N{sub 2} environment was also increased.
- OSTI ID:
- 477399
- Report Number(s):
- CONF-951155-; ISBN 1-55899-299-5; TRN: 97:009412
- Resource Relation:
- Conference: Fall meeting of the Materials Research Society (MRS), Boston, MA (United States), 27 Nov - 1 Dec 1995; Other Information: PBD: 1996; Related Information: Is Part Of Ion-solid interactions for materials modification and processing; Poker, D.B. [ed.] [Oak Ridge National Lab., TN (United States)]; Ila, D. [ed.] [Alabama A and M Univ., Normal, AL (United States)]; Cheng, Y.T. [ed.] [General Motors Corp., Warren, MI (United States)]; Harriott, L.R. [ed.] [AT and T Bell Labs., Murray Hill, NJ (United States)]; Sigmon, T.W. [ed.] [Arizona State Univ., Tempe, AZ (United States)]; PB: 923 p.; Materials Research Society symposium proceedings, Volume 396
- Country of Publication:
- United States
- Language:
- English
Similar Records
Enhancing adhesion between thin metal films and polyimide substrate by Ar sup + irradiation
Mechanisms of laser activation of dielectric materials