Buoyant convection during the growth of compound semiconductors by the liquid-encapsulated Czochralski process with an axial magnetic field and with a non-axisymmetric temperature
- Univ. of Illinois, Urbana, IL (United States). Dept. of Mechanical and Industrial Engineering
This paper treats the buoyant convection of a molten semiconductor in a cylindrical crucible with a vertical axis, with a uniform vertical magnetic field, and with a non-axisymmetric temperature. Most previous treatments of melt motions with vertical magnetic fields have assumed that the temperature and buoyant convection were axisymmetric. In reality, the temperature and resultant buoyant convection often deviate significantly from axisymmetry. For a given non-axisymmetric temperature, the electromagnetic suppression of the axisymmetric part of the buoyant convection is stronger than that of the non-axisymmetric part, so that the deviation from an axisymmetric melt motion increases as the magnetic field strength is increased. The non-axisymmetric part of the buoyant convection includes relatively strong azimuthal velocities adjacent to the electrically insulating vertical crucible wall, because this wall blocks the radial electric currents needed to suppress azimuthal velocities.
- Sponsoring Organization:
- National Science Foundation, Washington, DC (United States)
- OSTI ID:
- 435675
- Report Number(s):
- CONF-951135-; ISBN 0-7918-1751-2; TRN: IM9710%%333
- Resource Relation:
- Conference: 1995 International mechanical engineering congress and exhibition, San Francisco, CA (United States), 12-17 Nov 1995; Other Information: PBD: 1995; Related Information: Is Part Of Proceedings of the ASME Heat Transfer Division. Volume 2: Fire and combustion systems; Thermal-hydraulics in nuclear and hazardous waste processing and disposal; Transport phenomena in materials processing; HTD-Volume 317-2; Atreya, A. [ed.] [Univ. of Michigan, Ann Arbor, MI (United States)]; Gritzo, L. [ed.] [Sandia National Labs., Albuquerque, NM (United States)]; Saltiel, C. [ed.] [SCRAM Technology, Inc., Gainesville, FL (United States)] [and others]; PB: 592 p.
- Country of Publication:
- United States
- Language:
- English
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