Experimental comparison of different heat sink designs for cooling of electronics
Book
·
OSTI ID:423087
- Royal Inst. of Tech., Stockholm (Sweden)
Four different fin designs have been tested to determine which design to prefer for heat sinks used for cooling of electronics. The different fin designs include straight fins and pin fins with circular, quadratic and elliptical cross section. The thermal performance of the heat sinks is evaluated by comparing the thermal resistance of the heat sinks at equal velocity and equal pressure drop. The average heat transfer coefficient is also calculated.
- OSTI ID:
- 423087
- Report Number(s):
- CONF-960815-; ISBN 0-7918-1511-0; TRN: IM9707%%394
- Resource Relation:
- Conference: 31. national heat transfer conference, Houston, TX (United States), 3-6 Aug 1996; Other Information: PBD: 1996; Related Information: Is Part Of ASME proceedings of the 31. national heat transfer conference: Volume 7. HTD-Volume 329; Schmidt, R.; Anderson, A.; Mulay, S.; Kim, S.; Lee, S.; Price, D.C.; Kendall, M.; Frank, L.E.; Saums, D.L. [eds.]; PB: 261 p.
- Country of Publication:
- United States
- Language:
- English
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