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Title: Contact heat conductance at a diamond-OFHC copper interface with GaIn eutectic as a heat transfer medium

Abstract

The results of an experimental study of the contact heat conductance across a single diamond crystal interface with OFHC copper (Cu) are reported. Gallium-indium (GaIn) eutectic was used as an interstitial material. Contact conductance data are important in the design and the prediction of the performance of x-ray optics under high-heat-load conditions. Two sets of experiments were carried out. In one, the copper surface in contact with diamond was polished and then electroless plated with 1 {mu}m of nickel, while in the other, the copper contact surface was left as machined. The measured average interface heat conductances are 44.7{plus_minus}8 W/cm{sup 2}-K for nonplated copper and 23.0{plus_minus}8 W/cm{sup 2}-K for nickel-plated copper. For reference, the thermal contact conductances at a copper-copper interface (without diamond) were also measured, and the results are reported. A typical diamond monochromator, 0.2 mm thick, will absorb about 44 W under a standard undulator beam at the Advanced Photon Source. The measured conductance for nickel-plated copper suggests that the temperature drop across the interface of diamond and nickel-plated copper, with a 20 mm {sup 2}contact area, will be about 10{degree}C. Therefore temperature rises are rather modest, and the accuracy of the measured contact conductances presented here aremore » sufficient for design purposes. {copyright} {ital 1996 American Institute of Physics.}« less

Authors:
;  [1]
  1. Experimental Facilities Division, Advanced Photon Source, Argonne National Laboratory, Argonne, Illinois 60439 (United States)
Publication Date:
Research Org.:
Argonne National Lab. (ANL), Argonne, IL (United States)
OSTI Identifier:
390340
Report Number(s):
CONF-9510119-
Journal ID: RSINAK; ISSN 0034-6748; TRN: 96:027947
DOE Contract Number:  
W-31109-ENG-38
Resource Type:
Journal Article
Journal Name:
Review of Scientific Instruments
Additional Journal Information:
Journal Volume: 67; Journal Issue: 9; Conference: SRI `95: synchrotron radiation instrumentation symposium and the 7. users meeting for the advanced photon source (APS), Argonne, IL (United States), 16-20 Oct 1995; Other Information: PBD: Sep 1996
Country of Publication:
United States
Language:
English
Subject:
43 PARTICLE ACCELERATORS; 44 INSTRUMENTATION, INCLUDING NUCLEAR AND PARTICLE DETECTORS; DIAMONDS; THERMAL CONDUCTION; COPPER; MONOCHROMATORS; DESIGN; X-RAY EQUIPMENT; HEAT TRANSFER; EUTECTICS; GALLIUM; INDIUM; OPTICAL SYSTEMS; HEATING LOAD; INTERFACES

Citation Formats

Assoufid, L, and Khounsary, A. Contact heat conductance at a diamond-OFHC copper interface with GaIn eutectic as a heat transfer medium. United States: N. p., 1996. Web. doi:10.1063/1.1147400.
Assoufid, L, & Khounsary, A. Contact heat conductance at a diamond-OFHC copper interface with GaIn eutectic as a heat transfer medium. United States. https://doi.org/10.1063/1.1147400
Assoufid, L, and Khounsary, A. 1996. "Contact heat conductance at a diamond-OFHC copper interface with GaIn eutectic as a heat transfer medium". United States. https://doi.org/10.1063/1.1147400.
@article{osti_390340,
title = {Contact heat conductance at a diamond-OFHC copper interface with GaIn eutectic as a heat transfer medium},
author = {Assoufid, L and Khounsary, A},
abstractNote = {The results of an experimental study of the contact heat conductance across a single diamond crystal interface with OFHC copper (Cu) are reported. Gallium-indium (GaIn) eutectic was used as an interstitial material. Contact conductance data are important in the design and the prediction of the performance of x-ray optics under high-heat-load conditions. Two sets of experiments were carried out. In one, the copper surface in contact with diamond was polished and then electroless plated with 1 {mu}m of nickel, while in the other, the copper contact surface was left as machined. The measured average interface heat conductances are 44.7{plus_minus}8 W/cm{sup 2}-K for nonplated copper and 23.0{plus_minus}8 W/cm{sup 2}-K for nickel-plated copper. For reference, the thermal contact conductances at a copper-copper interface (without diamond) were also measured, and the results are reported. A typical diamond monochromator, 0.2 mm thick, will absorb about 44 W under a standard undulator beam at the Advanced Photon Source. The measured conductance for nickel-plated copper suggests that the temperature drop across the interface of diamond and nickel-plated copper, with a 20 mm {sup 2}contact area, will be about 10{degree}C. Therefore temperature rises are rather modest, and the accuracy of the measured contact conductances presented here are sufficient for design purposes. {copyright} {ital 1996 American Institute of Physics.}},
doi = {10.1063/1.1147400},
url = {https://www.osti.gov/biblio/390340}, journal = {Review of Scientific Instruments},
number = 9,
volume = 67,
place = {United States},
year = {Sun Sep 01 00:00:00 EDT 1996},
month = {Sun Sep 01 00:00:00 EDT 1996}
}