Multifunctional structural electronic packaging for smallsat spacecraft design
- Applied Material Technologies, Inc., 3611 South Harbor Blvd., Suite 225, Santa Ana, California 92704-6928 (United States)
Future smallsat missions require sophisticated payloads and instrumentation that need to be packaged in a weight and volume constrained design. A high degree of signal processing performance coupled with less physical volume requires innovative electronics packaging concepts that achieve smaller area and volume, are lightweight and are highly reliable. This paper describes the development of a multifunctional structural electronics packaging approach that combines advanced electronics packaging with lightweight structures and thermal management technology by laminating printed circuits integrally into the structural facesheets/panels. The primary constituents are a sandwich structure comprised of: (1) Integrated circuits (ICs)/chip carriers or chips-on-film mounted on a multilayered PWB; (2) Carbon fiber composite constraining core layers laminated within the PWB itself, or on a carbon fiber composite internal facesheet; (3) a sandwich structure core that matches the thermal coefficient of expansion (TCE) of the electronics components; and, (4) an external radiating facesheet. {copyright} {ital 1996 American Institute of Physics.}
- OSTI ID:
- 385444
- Report Number(s):
- CONF-960109-; ISSN 0094-243X; TRN: 9618M0046
- Journal Information:
- AIP Conference Proceedings, Vol. 361, Issue 1; Conference: STAIF 96: space technology and applications international forum, Albuquerque, NM (United States), 7-11 Jan 1996; Other Information: PBD: Mar 1996
- Country of Publication:
- United States
- Language:
- English
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