On the structure and strength of ultrafine-grained copper produced by severe plastic deformation

Journal Article · Sat Jan 15 00:00:00 EST 1994 · Scripta Metallurgica et Materialia

DOI:https://doi.org/10.1016/0956-716X(94)90045-0· OSTI ID:231087

Gertsman, V Y ^[1]; Birringer, R; Gleiter, H ^[1]; Valiev, R Z ^[2]

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1. Univ. des Saarlandes, Saarbruecken (Germany)
2. Russian Academy of Sciences, Ufa (Russian Federation). Inst. of Metals Superplasticity Problems

In the last few years materials with ultrafine-grained (UFG) structures having grain size in the range of nanometers or submicrometers have attracted considerable attention of researchers in various areas. However, there are still many open questions concerning the structure of UFG materials, because direct structural studies are difficult in the case of very fine grains. The behavior of submicrometer-grained materials is similar in many aspects to that of nanostructured materials. Due to the coarser grains they are more suitable for structural investigation. This paper deals with the annealing temperature dependence of the structure and room-temperature yield stress of submicrometer-grained copper.

• OSTI ID: 231087
• Journal Information: Scripta Metallurgica et Materialia, Vol. 30, Issue 2; Other Information: PBD: 15 Jan 1994
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
COPPER
YIELD STRENGTH
MICROSTRUCTURE
X-RAY DIFFRACTION
CRYSTAL LATTICES
DISLOCATIONS
EXPERIMENTAL DATA