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Title: Effect of Ni diffusion annealing temperature on crucial characterization of Bi-2223 superconducting system

Journal Article · · AIP Conference Proceedings
DOI:https://doi.org/10.1063/1.4944197· OSTI ID:22590987

In this current work, influence of diffusion annealing temperature (650-850°C) on the electrical, superconducting and structural characterizations of pure and Ni diffused Bi-2223 materials produced by conventional solid-state reaction route is surveyed by dc electrical resistivity (ρ-T), transport critical current density (J{sub c}) and powder X-ray diffraction (XRD) measurements. All the experimental findings indicate that the curial characteristics, being responsible for the novel and feasible applications, improve significantly with the enhancement of the diffusion annealing temperature up to the certain value of 700 °C after which they degrade dramatically, meaning that the properties initially get better and better as a consequence of the penetration of more and more Ni concentrations into the superconducting grains or over grain boundaries in the Bi-2223 crystal matrix. From the diffusion annealing temperature value of 700 °C onwards, the excess penetration of the Ni nanoparticles along with consecutively stacked layers in the Bi-2223 crystal structure is, however, unfavorable for the attractive and feasible applications due to new induced disorders, local structural distortions and artificial dislocations.

OSTI ID:
22590987
Journal Information:
AIP Conference Proceedings, Vol. 1722, Issue 1; Conference: BPU-9: 9. international physics conference of the Balkan Physical Union, Istanbul (Turkey), 24-27 Aug 2015; Other Information: (c) 2016 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
Country of Publication:
United States
Language:
English