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Title: Comparison of gate dielectric plasma damage from plasma-enhanced atomic layer deposited and magnetron sputtered TiN metal gates

Fully depleted silicon-on-insulator transistors were fabricated using two different metal gate deposition mechanisms to compare plasma damage effects on gate oxide quality. Devices fabricated with both plasma-enhanced atomic-layer-deposited (PE-ALD) TiN gates and magnetron plasma sputtered TiN gates showed very good electrostatics and short-channel characteristics. However, the gate oxide quality was markedly better for PE-ALD TiN. A significant reduction in interface state density was inferred from capacitance-voltage measurements as well as a 1200× reduction in gate leakage current. A high-power magnetron plasma source produces a much higher energetic ion and vacuum ultra-violet (VUV) photon flux to the wafer compared to a low-power inductively coupled PE-ALD source. The ion and VUV photons produce defect states in the bulk of the gate oxide as well as at the oxide-silicon interface, causing higher leakage and potential reliability degradation.
Authors:
; ;  [1]
  1. Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts 02420 (United States)
Publication Date:
OSTI Identifier:
22494670
Resource Type:
Journal Article
Resource Relation:
Journal Name: Journal of Applied Physics; Journal Volume: 118; Journal Issue: 4; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; CAPACITANCE; DAMAGE; DEFECTS; DEPOSITION; DIELECTRIC MATERIALS; ELECTRIC POTENTIAL; ELECTROSTATICS; FAR ULTRAVIOLET RADIATION; LEAKAGE CURRENT; MAGNETRONS; OXIDES; PLASMA; SILICON; SPUTTERING; TAIL IONS; TITANIUM NITRIDES; TRANSISTORS