skip to main content

Title: Silver-containing polymer composition used in spacecraft and semiconductor optoelectronics control systems

The copolymer of the vinyl chloride-maleic anhydride and silver nano- and microparticle (70 wt %) composition is offered as a conductive adhesive for fixing various chips on the dielectric substrate. The wiring volume resistivity is up to 3.1×10{sup −8} Ohm×m. The adhesive strength of the silver-containing polymer composition (70% of Ag) applied under a shear on the dielectric substrate is 106 N/mm{sup 2}. Adhesive layers obtained from these substances have a high thermal conductivity up to λ = 199.93 W/m×K that depends on the amount of Ag in the polymer composition.
Authors:
;  [1]
  1. Tomsk State University of Control Systems and Radioelectronics, Tomsk, 634050 (Russian Federation)
Publication Date:
OSTI Identifier:
22492532
Resource Type:
Journal Article
Resource Relation:
Journal Name: AIP Conference Proceedings; Journal Volume: 1683; Journal Issue: 1; Conference: International conference on advanced materials with hierarchical structure for new technologies and reliable structures 2015, Tomsk (Russian Federation), 21-25 Sep 2015; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; 42 ENGINEERING; ADHESIVES; ANHYDRIDES; CONTROL SYSTEMS; COPOLYMERS; DIELECTRIC MATERIALS; LAYERS; OPTOELECTRONIC DEVICES; SEMICONDUCTOR MATERIALS; SHEAR; SILVER; SPACE VEHICLES; SUBSTRATES; THERMAL CONDUCTIVITY; VINYL CHLORIDE; WIRES