skip to main content

Title: Influence of porosity on thermophysical properties of a composite

In many modern information systems, the heat generated during the operation of electronic devices is usually dissipated by heat-conductive pads between the casing of the respective equipment and a massive base (platform). For newly developed pads, the promising materials are composites on the basis of various types of silicone rubber. At the same time, during the production of the pads without a vacuum setup, the material can contain air bubbles, which causes the porosity potentially negative for the thermal properties of the material. This work studies the thermal conductivity depending on the degree of silicone matrix filling by copper particles, introduced to improve thermal conductivity, and by air bubbles that are considered as reinforcing inclusions.
Authors:
; ;  [1] ;  [2] ;  [3]
  1. Institute of Strength Physics and Materials Science SB RAS, Tomsk, 634055 (Russian Federation)
  2. (Russian Federation)
  3. Tomsk State University of Control Systems and Radioelectronics, Tomsk, 634050 (Russian Federation)
Publication Date:
OSTI Identifier:
22492528
Resource Type:
Journal Article
Resource Relation:
Journal Name: AIP Conference Proceedings; Journal Volume: 1683; Journal Issue: 1; Conference: International conference on advanced materials with hierarchical structure for new technologies and reliable structures 2015, Tomsk (Russian Federation), 21-25 Sep 2015; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; AIR; BUBBLES; COMPOSITE MATERIALS; COPPER; ELECTRONIC EQUIPMENT; HEAT; POROSITY; RUBBERS; SILICONES; THERMAL CONDUCTIVITY