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Title: Tensile behavior and flow stress anisotropy of accumulative roll bonded Cu-Nb nanolaminates

The flow stress, ductility, and in-plane anisotropy are evaluated for bulk accumulative roll bonded copper-niobium nanolaminates with layer thicknesses ranging from 1.8 μm to 15 nm. Uniaxial tensile tests conducted parallel to the rolling direction and transverse direction demonstrate that ductility generally decreases with decreasing layer thickness; however, at 30 nm, both high strengths (1200 MPa) and significant ductility (8%) are achieved. The yield strength increases monotonically with decreasing layer thickness, consistent with the Hall-Petch relationship, and significant in-plane flow stress anisotropy is observed. Taylor polycrystal modeling is used to demonstrate that crystallographic texture is responsible for the in-plane anisotropy and that the effects of texture dominate even at nanoscale layer thicknesses.
Authors:
; ;  [1] ;  [2] ;  [3]
  1. Materials Department, University of California Santa Barbara, Santa Barbara, California 93106 (United States)
  2. Theoretical Division, Los Alamos National Laboratory, Los Alamos, New Mexico 87545 (United States)
  3. Institute for Materials Science and the Center for Integrated Nanotechnologies, Los Alamos National Laboratory, Los Alamos, New Mexico 87545 (United States)
Publication Date:
OSTI Identifier:
22489400
Resource Type:
Journal Article
Resource Relation:
Journal Name: Applied Physics Letters; Journal Volume: 108; Journal Issue: 5; Other Information: (c) 2016 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; ANISOTROPY; COPPER; CRYSTALLOGRAPHY; DUCTILITY; FLOW STRESS; LAYERS; NANOSTRUCTURES; NIOBIUM; PRESSURE RANGE MEGA PA; TEXTURE; THICKNESS; YIELD STRENGTH