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Title: Stress-directed compositional patterning of SiGe substrates for lateral quantum barrier manipulation

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.4928550· OSTI ID:22489112
 [1]; ;  [2];  [3]
  1. Department of Electrical and Computer Engineering, University of New Mexico, Albuquerque, New Mexico 87131 (United States)
  2. Department of Chemical and Biomolecular Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104 (United States)
  3. Department of Chemical and Biological Engineering, University of New Mexico, Albuquerque, New Mexico 87131 (United States)

While vertical stacking of quantum well and dot structures is well established in heteroepitaxial semiconductor materials, manipulation of quantum barriers in the lateral directions poses a significant engineering challenge. Here, we demonstrate lateral quantum barrier manipulation in a crystalline SiGe alloy using structured mechanical fields to drive compositional redistribution. To apply stress, we make use of a nano-indenter array that is pressed against a Si{sub 0.8}Ge{sub 0.2} wafer in a custom-made mechanical press. The entire assembly is then annealed at high temperatures, during which the larger Ge atoms are selectively driven away from areas of compressive stress. Compositional analysis of the SiGe substrates reveals that this approach leads to a transfer of the indenter array pattern to the near-surface elemental composition, resulting in near 100% Si regions underneath each indenter that are separated from each other by the surrounding Si{sub 0.8}Ge{sub 0.2} bulk. The “stress transfer” process is studied in detail using multiscale computer simulations that demonstrate its robustness across a wide range of applied stresses and annealing temperatures. While the “Si nanodot” structures formed here are not intrinsically useful as quantum structures, it is anticipated that the stress transfer process may be modified by judicious control of the SiGe film thickness and indenter array pattern to form more technologically useful structures.

OSTI ID:
22489112
Journal Information:
Applied Physics Letters, Vol. 107, Issue 7; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
Country of Publication:
United States
Language:
English