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Title: Investigation of electrochemical migration on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy in HNO{sub 3} solution

Current issue in lead-free solder in term of its reliability is still under investigation. This high impact research attempts to investigate the electrochemical migration (ECM) on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy by Water Drop Test (WDT) in different concentration of HNO{sub 3} solution. The concentration of HNO{sub 3} solution used in this research was 0.05, 0.10, 0.50 and 1M. Optical Microscope (OM), Field Emission Scanning Electron Microscope (FESEM) and Energy Dispersive X-Ray Analysis (EDX) were carried out in order to analysis the ECM behavior based on the growth of dendrite formation after WDT. In general, the results demonstrated that dendrite growth is faster in higher concentration compared with low concentration of HNO{sub 3}. The concentration of HNO{sub 3} solution used has a strong correlation with Mean-Time-To-Failure (MTTF). As the concentration of HNO{sub 3} increases, the MTTF value decreases. Based on the MTTF results the solder alloy in 1M HNO{sub 3} solution is most susceptible to ECM. SnO{sub 2} forms as a corrosion by-product in the samples proved by EDX analysis. The solder alloy poses a high reliability risk in microelectronic devices during operation in 1M HNO{sub 3} solution.
Authors:
;  [1] ; ; ;  [2]
  1. School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600, Bangi, Selangor (Malaysia)
  2. Jabil Circuit Sdn Bhd, Bayan Lepas Industrial Park, 11900, Penang (Malaysia)
Publication Date:
OSTI Identifier:
22488971
Resource Type:
Journal Article
Resource Relation:
Journal Name: AIP Conference Proceedings; Journal Volume: 1678; Journal Issue: 1; Conference: Universiti Kebangsaan Malaysia, Faculty of Science and Technology 2015 Postgraduate Colloquium, Selangor (Malaysia), 15-16 Apr 2015; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; ABUNDANCE; COMPARATIVE EVALUATIONS; CONCENTRATION RATIO; COPPER ALLOYS; CORROSION; DENDRITES; ELECTROCHEMISTRY; FIELD EMISSION; NICKEL ADDITIONS; NITRIC ACID; PHOSPHORUS ADDITIONS; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SOLUTIONS; TIN ALLOYS; TIN OXIDES; WATER; X-RAY SPECTROSCOPY