skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Sub-50 nm metrology on extreme ultra violet chemically amplified resist—A systematic assessment

Journal Article · · Review of Scientific Instruments
DOI:https://doi.org/10.1063/1.4932038· OSTI ID:22482564
;  [1]; ; ;  [2];  [1]
  1. Netherlands Organization for Applied Scientific Research, TNO, Stieltjesweg 1, 2628CK Delft (Netherlands)
  2. ASML, de Run 6665, 5504DR Veldhoven (Netherlands)

With lithographic patterning dimensions decreasing well below 50 nm, it is of high importance to understand metrology at such small scales. This paper presents results obtained from dense arrays of contact holes (CHs) with various Critical Dimension (CD) between 15 and 50 nm, as patterned in a chemically amplified resist using an ASML EUV scanner and measured at ASML and TNO. To determine the differences between various (local) CD metrology techniques, we conducted an experiment using optical scatterometry, CD-Scanning Electron Microscopy (CD-SEM), Helium ion Microscopy (HIM), and Atomic Force Microscopy (AFM). CD-SEM requires advanced beam scan strategies to mitigate sample charging; the other tools did not need that. We discuss the observed main similarities and differences between the various techniques. To this end, we assessed the spatial frequency content in the raw images for SEM, HIM, and AFM. HIM and AFM resolve the highest spatial frequencies, which are attributed to the more localized probe-sample interaction for these techniques. Furthermore, the SEM, HIM, and AFM waveforms are analyzed in detail. All techniques show good mutual correlation, albeit the reported CD values systematically differ significantly. HIM systematically reports a 25% higher CD uniformity number than CD-SEM for the same arrays of CHs, probably because HIM has a higher resolution than the CD-SEM used in this assessment. A significant speed boost for HIM and AFM is required before these techniques are to serve the demanding industrial metrology applications like optical critical dimension and CD-SEM do nowadays.

OSTI ID:
22482564
Journal Information:
Review of Scientific Instruments, Vol. 86, Issue 10; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0034-6748
Country of Publication:
United States
Language:
English

Similar Records

Line Edge Roughness and Cross Sectional Characterization of Sub-50 nm Structures Using Critical Dimension Small Angle X-ray Scattering
Journal Article · Wed Sep 26 00:00:00 EDT 2007 · AIP Conference Proceedings · OSTI ID:22482564

Hybrid Metrology and 3D-AFM Enhancement for CD Metrology Dedicated to 28 nm Node and Below Requirements
Journal Article · Thu Nov 10 00:00:00 EST 2011 · AIP Conference Proceedings · OSTI ID:22482564

Multiparameter grating metrology using optical scatterometry
Journal Article · Sat Mar 01 00:00:00 EST 1997 · Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena · OSTI ID:22482564