Development of high-vacuum planar magnetron sputtering using an advanced magnetic field geometry

Journal Article · Sun Nov 15 00:00:00 EST 2015 · Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films

DOI:https://doi.org/10.1116/1.4927442· OSTI ID:22479684

Ohno, Takahiro; Yagyu, Daisuke; Saito, Shigeru; Ohno, Yasunori; Itoh, Masatoshi; Uhara, Yoshio; Miura, Tsutomu ^[1]; Nakano, Hirofumi ^[2]

---

1. Department of Electrical Engineering, Faculty of Engineering, Tokyo University of Science, 6-3-1 Niijuku, Katsushika-ku, Tokyo 125-8585 (Japan)
2. Ikazuti Ltd., 3-28-10 Kikunodai, Chofu, Tokyo 182-0007 (Japan)

A permanent magnet in a new magnetic field geometry (namely, with the magnetization in the radial direction) was fabricated and used for high-vacuum planar magnetron sputtering using Penning discharge. Because of the development of this magnet, the discharge current and deposition rate were increased two to three times in comparison with the values attainable with a magnet in the conventional geometry. This improvement was because the available space for effective discharge of the energetic electrons for the ionization increased because the magnetic field distribution increased in both the axial and radial directions of discharge.

• OSTI ID: 22479684
• Journal Information: Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films, Vol. 33, Issue 6; Other Information: (c) 2015 American Vacuum Society; Country of input: International Atomic Energy Agency (IAEA); ISSN 0734-2101
• Country of Publication: United States
• Language: English

Related Subjects

75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
42 ENGINEERING
COMPARATIVE EVALUATIONS
DEPOSITION
DISTRIBUTION
ELECTRIC CURRENTS
MAGNETIC FIELDS
MAGNETIZATION
MAGNETRONS
PENNING DISCHARGES
PERMANENT MAGNETS
SPUTTERING