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Title: Microstructure and transformation behavior of Ni{sub 24.7}Ti{sub 50.3}Pd{sub 25} high temperature shape-memory alloy with Sc micro-addition

NiTiPd shape-memory alloys (SMAs) are potential functional materials for use as solid-state actuators in the temperature range 100–250 °C. The present study investigates the effect of 1.0 at.% Sc micro-addition to Ni{sub 24.7}Ti{sub 50.3}Pd{sub 25} alloy, Sc replacing either Ti or Ni. Results show that all the three alloys studied have stable transformation behavior on stress-free thermal cycling and hence, are suitable for cyclic actuation applications. However, the addition of Sc to NiTiPd alloy leads to decrease of transformation temperatures, the magnitude of decrease being greater for the alloy with Sc replacing Ni. The martensite finish (M{sub f}) temperature of 181 °C for the NiTiPd alloy decreased to 139 °C for Sc replacing Ti and 83 °C for Sc replacing Ni. Also, the indentation modulus of NiTiPdSc (Sc replacing Ni) alloy is found to be significantly low compared to the other alloys. Analysis indicates that the observed differences in the alloy properties are related to the solubility of Sc in the NiTiPd matrix. While the quaternary NiTiPdSc alloy, Sc replacing Ti, has a single phase microstructure, the alloy with Sc replacing Ni shows the presence of Sc-rich and TiPd-type second phases in the microstructure. TEM examination revealed that the TiPd-typemore » phase has a distinct rod-like morphology (30–50 nm) arranged in a grid-like structure. The transformation and indentation behavior of the alloys is elucidated using thermodynamic calculations of frictional energy and an electronic structure based analysis. - Highlights: • TEM of Ni{sub 23.7}Ti{sub 50.3}Pd{sub 25}Sc{sub 1} showed distinct grid of TiPd-type phase nanorods < 50 nm. • Stress-free thermal cycling of all the three alloys showed stable transformation behavior. • Ni{sub 24.7}Ti{sub 49.3}Pd{sub 25}Sc{sub 1} and Ni{sub 23.7}Ti{sub 50.3}Pd{sub 25}Sc{sub 1} showed single and multiphase structures. • Sc micro-addition (1 at.%) to Ni{sub 24.7}Ti{sub 50.3}Pd{sub 25} alloy decreased TTs significantly. • Ni{sub 23.7}Ti{sub 50.3}Pd{sub 25}Sc{sub 1} exhibited lower modulus of 67 GPa to 85 GPa of Ni{sub 24.7}Ti{sub 50.3}Pd{sub 25}.« less
Authors:
 [1] ;  [1] ;  [2] ;  [1]
  1. Materials Science Division, CSIR-National Aerospace Laboratories, Bangalore 560 017 (India)
  2. Department of Materials Science and Engineering, Indian Institute of Technology, Kanpur 208 016 (India)
Publication Date:
OSTI Identifier:
22476122
Resource Type:
Journal Article
Resource Relation:
Journal Name: Materials Characterization; Journal Volume: 106; Other Information: Copyright (c) 2015 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; ELECTRONIC STRUCTURE; MARTENSITE; MICROSTRUCTURE; NANOSTRUCTURES; NICKEL COMPOUNDS; PALLADIUM COMPOUNDS; PHASE TRANSFORMATIONS; PRESSURE RANGE GIGA PA; SCANDIUM ADDITIONS; SHAPE MEMORY EFFECT; SOLUBILITY; THERMAL CYCLING; TITANIUM COMPOUNDS; TRANSMISSION ELECTRON MICROSCOPY