skip to main content

SciTech ConnectSciTech Connect

Title: Dislocation density of pure copper processed by accumulative roll bonding and equal-channel angular pressing

The dislocation density of pure copper fabricated by two severe plastic deformation (SPD) processes, i.e., accumulative roll bonding and equal-channel angular pressing, was evaluated using scanning transmission electron microscopy/transmission electron microscopy observations. The dislocation density drastically increased from ~ 10{sup 13} m{sup −} {sup 2} to about 5 × 10{sup 14} m{sup −} {sup 2}, and then saturated, for both SPD processes.
Authors:
 [1] ; ; ;  [1] ;  [2] ; ;  [1]
  1. Department of Materials Science and Engineering, Graduate School of Science and Engineering, Tokyo Institute of Technology, 4259-J2-63, Nagatsuta-cho, Midori-ku, Yokohama 226-8502 (Japan)
  2. Department of Metallurgy and Ceramics Science, Graduate School of Engineering, Tokyo Institute of Technology, 2-12-1-S8-7, Ookayama, Meguro-ku, Tokyo 152-8552 (Japan)
Publication Date:
OSTI Identifier:
22476100
Resource Type:
Journal Article
Resource Relation:
Journal Name: Materials Characterization; Journal Volume: 104; Other Information: Copyright (c) 2015 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; BONDING; COPPER; DENSITY; DISLOCATIONS; GRAIN SIZE; PLASTICITY; TRANSMISSION ELECTRON MICROSCOPY