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Title: Deposition of copper coatings in a magnetron with liquid target

Copper coatings were deposited on monocrystalline Si substrates using a magnetron discharge with a liquid cathode in the metal vapour plasma. During the deposition, the bias voltage in the range from 0 V to–400 V was applied to the substrate. The prepared films were investigated by a scanning electron microscope, and their adhesive properties were studied using a scratch tester. It was demonstrated that the adhesion of the deposited films strongly depends on the bias voltage and varies in a wide range.
Authors:
; ; ; ; ;  [1]
  1. National Research Nuclear University MEPhI (Moscow Engineering Physics Institute) (Russian Federation)
Publication Date:
OSTI Identifier:
22471867
Resource Type:
Journal Article
Resource Relation:
Journal Name: Physics of Atomic Nuclei; Journal Volume: 78; Journal Issue: 14; Other Information: Copyright (c) 2015 Pleiades Publishing, Ltd.; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; ADHESION; ADHESIVES; CATHODES; COATINGS; COPPER; DEPOSITION; ELECTRIC POTENTIAL; FILMS; LIQUIDS; MAGNETRONS; PLASMA; SCANNING ELECTRON MICROSCOPY; SILICON; SUBSTRATES; VAPORS