Deposition of copper coatings in a magnetron with liquid target

Journal Article · Tue Dec 15 00:00:00 EST 2015 · Physics of Atomic Nuclei

DOI:https://doi.org/10.1134/S1063778815140136· OSTI ID:22471867

Kaziev, A. V.; Kolodko, D. V.; Pisarev, A. A.; Kharkov, M. M.; Khodachenko, G. V. ^[1]

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1. National Research Nuclear University MEPhI (Moscow Engineering Physics Institute) (Russian Federation)

Copper coatings were deposited on monocrystalline Si substrates using a magnetron discharge with a liquid cathode in the metal vapour plasma. During the deposition, the bias voltage in the range from 0 V to–400 V was applied to the substrate. The prepared films were investigated by a scanning electron microscope, and their adhesive properties were studied using a scratch tester. It was demonstrated that the adhesion of the deposited films strongly depends on the bias voltage and varies in a wide range.

• OSTI ID: 22471867
• Journal Information: Physics of Atomic Nuclei, Vol. 78, Issue 14; Other Information: Copyright (c) 2015 Pleiades Publishing, Ltd.; Country of input: International Atomic Energy Agency (IAEA); ISSN 1063-7788
• Country of Publication: United States
• Language: English

Related Subjects

75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ADHESION
ADHESIVES
CATHODES
COATINGS
COPPER
DEPOSITION
ELECTRIC POTENTIAL
FILMS
LIQUIDS
MAGNETRONS
PLASMA
SCANNING ELECTRON MICROSCOPY
SILICON
SUBSTRATES
VAPORS