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Title: Thermodynamic understanding of Sn whisker growth on the Cu surface in Cu(top)-Sn(bottom) bilayer system upon room temperature aging

Sn whiskers are observed by scanning electron microscope on the Cu surface in Cu(top)-Sn(bottom) bilayer system upon room temperature aging. Only Cu{sub 6}Sn{sub 5} phase appears in the X-ray diffraction patterns and no Sn element is detected in the Cu sublayer by scanning transmission electron microscopy. Based on the interfacial thermodynamics, the intermetallic Cu{sub 6}Sn{sub 5} compound phase may form directly at the Sn grain boundary. Driven by the stress gradient during the formation of Cu{sub 6}Sn{sub 5} compound at Sn grain boundaries, Sn atoms segregate onto the Cu surface and accumulate to form Sn whisker.
Authors:
; ; ;  [1] ;  [2] ;  [3] ;  [4]
  1. Department of Physics, Shantou University, 243 Daxue Road, Shantou, 515063 Guangdong (China)
  2. School of Materials Science and Engineering, Nanchang University, Nanchang, 330031 Jiangxi (China)
  3. (China)
  4. Institute of Physics, Chinese Academy of Sciences, 100190 Beijing (China)
Publication Date:
OSTI Identifier:
22412894
Resource Type:
Journal Article
Resource Relation:
Journal Name: Journal of Applied Physics; Journal Volume: 117; Journal Issue: 21; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; COPPER; GRAIN BOUNDARIES; INTERMETALLIC COMPOUNDS; LAYERS; SCANNING ELECTRON MICROSCOPY; STRESSES; SURFACES; TEMPERATURE RANGE 0273-0400 K; THERMODYNAMICS; TIN; TRANSMISSION ELECTRON MICROSCOPY; WHISKERS; X-RAY DIFFRACTION