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Title: Thermal flux limited electron Kapitza conductance in copper-niobium multilayers

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.4913420· OSTI ID:22412772
; ; ; ; ; ;  [1];  [2];  [3];  [4]
  1. Sandia National Laboratories, Albuquerque, New Mexico 87123 (United States)
  2. Department of Materials Science and Engineering, University of California, Berkeley, California 94720 (United States)
  3. Los Alamos National Laboratory, Los Alamos, New Mexico 87545 (United States)
  4. Department of Materials Science and Engineering, University of Michigan, Ann Arbor, Michigan 48109 (United States)
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We study the interplay between the contributions of electron thermal flux and interface scattering to the Kapitza conductance across metal-metal interfaces through measurements of thermal conductivity of copper-niobium multilayers. Thermal conductivities of copper-niobium multilayer films of period thicknesses ranging from 5.4 to 96.2 nm and sample thicknesses ranging from 962 to 2677 nm are measured by time-domain thermoreflectance over a range of temperatures from 78 to 500 K. The Kapitza conductances between the Cu and Nb interfaces in multilayer films are determined from the thermal conductivities using a series resistor model and are in good agreement with the electron diffuse mismatch model. Our results for the thermal boundary conductance between Cu and Nb are compared to literature values for the thermal boundary conductance across Al-Cu and Pd-Ir interfaces, and demonstrate that the interface conductance in metallic systems is dictated by the temperature derivative of the electron energy flux in the metallic layers, rather than electron mean free path or scattering processes at the interface.

OSTI ID:
22412772
Journal Information:
Applied Physics Letters, Vol. 106, Issue 9; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
Country of Publication:
United States
Language:
English

Cited By (7)

A Review of Experimental and Computational Advances in Thermal Boundary Conductance and Nanoscale Thermal Transport across Solid Interfaces journal August 2019
Femtosecond laser generation of microbumps and nanojets on single and bilayer Cu/Ag thin films journal January 2019
Thin Ti adhesion layer breaks bottleneck to hot hole relaxation in Au films journal May 2019
Spatially resolved thermoreflectance techniques for thermal conductivity measurements from the nanoscale to the mesoscale journal October 2019
Titanium contacts to graphene: process-induced variability in electronic and thermal transport journal February 2018
Determining heat-transfer coefficients of solid objects by laser photothermal IR radiometry journal July 2017
Titanium Contacts to Graphene: Process-Induced Variability in Electronic and Thermal Transport text January 2017

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Related Subjects

75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ALUMINIUM
COMPARATIVE EVALUATIONS
COPPER
ELECTRONS
FILMS
INTERFACES
IRIDIUM
LAYERS
MEAN FREE PATH
NIOBIUM
PALLADIUM
RESISTORS
THERMAL CONDUCTIVITY