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Title: Parallel-plate submicron gap formed by micromachined low-density pillars for near-field radiative heat transfer

Near-field radiative heat transfer has been a subject of great interest due to the applicability to thermal management and energy conversion. In this letter, a submicron gap between a pair of diced fused quartz substrates is formed by using micromachined low-density pillars to obtain both the parallelism and small parasitic heat conduction. The gap uniformity is validated by the optical interferometry at four corners of the substrates. The heat flux across the gap is measured in a steady-state and is no greater than twice of theoretically predicted radiative heat flux, which indicates that the parasitic heat conduction is suppressed to the level of the radiative heat transfer or less. The heat conduction through the pillars is modeled, and it is found to be limited by the thermal contact resistance between the pillar top and the opposing substrate surface. The methodology to form and evaluate the gap promotes the near-field radiative heat transfer to various applications such as thermal rectification, thermal modulation, and thermophotovoltaics.
Authors:
 [1] ;  [2] ; ;  [1] ;  [3]
  1. Toyota Central Research and Development Laboratories, Nagakute, Aichi 480-1192 (Japan)
  2. (RCAST), The University of Tokyo, Komaba, Meguro-ku, Tokyo 153-8904 (Japan)
  3. Research Center for Advanced Science and Technology (RCAST), The University of Tokyo, Komaba, Meguro-ku, Tokyo 153-8904 (Japan)
Publication Date:
OSTI Identifier:
22412723
Resource Type:
Journal Article
Resource Relation:
Journal Name: Applied Physics Letters; Journal Volume: 106; Journal Issue: 8; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; DENSITY; ENERGY CONVERSION; HEAT FLUX; INTERFEROMETRY; MODULATION; PLATES; QUARTZ; STEADY-STATE CONDITIONS; SUBSTRATES; SURFACES; THERMAL CONDUCTION