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Title: Microstructure characterization of Cu processed by compression with oscillatory torsion

High purity Cu (99.9%) was subjected to severe plastic deformation up to a total effective strain ε{sub ft} = 130 through compression with the oscillatory torsion method at room temperature. This method produces an ultrafine grain microstructure. The microstructure evolution was investigated with respect to the value of the total effective strain using a scanning electron microscope with an electron-backscattered diffraction technique and a scanning transmission electron microscope. The results of the structural analyses show that increasing ε{sub ft} from 2 to 50 causes progress in the grain refinement. A quantitative study of the microstructure parameters, such as fraction of high angle boundaries, grain and subgrain diameter, and the area fraction of grains up to 1 μm, shows that deformation at ε{sub ft} = 45 guaranteed the best conditions for refining the microstructure of Cu. Using high values of ε{sub ft} in the range 60 to 130 restricts grain refinement because intensive recovery begins to dominate in the microstructure. - Highlights: • Cu was processed by SPD metodto an effective strain 130. • The microstructure evolution has been investigated. • The method allows to produce an ultrafine grain microstructure.
Authors:
 [1] ;  [2]
  1. Institute of Materials Science, Silesian University of Technology, Krasińskiego 8, 40-019 Katowice (Poland)
  2. Department of Automotive Vehicle Construction, Silesian University of Technology, Krasińskiego 8, 40–019 Katowice (Poland)
Publication Date:
OSTI Identifier:
22403519
Resource Type:
Journal Article
Resource Relation:
Journal Name: Materials Characterization; Journal Volume: 94; Other Information: Copyright (c) 2014 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; BACKSCATTERING; COMPRESSION; COPPER; DEFORMATION; ELECTRON DIFFRACTION; ELECTRONS; GRAIN BOUNDARIES; GRAIN REFINEMENT; PLASTICITY; SCANNING ELECTRON MICROSCOPY; STRAINS; TEMPERATURE RANGE 0273-0400 K; TORSION; TRANSMISSION ELECTRON MICROSCOPY