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Title: A method for the formation of Pt metal nanoparticle arrays using nanosecond pulsed laser dewetting

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.4921528· OSTI ID:22402467
; ; ;  [1]
  1. Institute for Technical Electrochemistry, Technische Universität München, D-85748 Garching (Germany)

Nanosecond pulsed laser dewetting of Pt thin films, deposited on a dimpled Ta (DT) surface, has been studied here in order to form ordered Pt nanoparticle (NP) arrays. The DT substrate was fabricated via a simple electrochemical anodization process in a highly concentrated H{sub 2}SO{sub 4} and HF solution. Pt thin films (3–5 nm) were sputter coated on DT and then dewetted under vacuum to generate NPs using a 355 nm laser radiation (6–9 ns, 10 Hz). The threshold laser fluence to fully dewet a 3.5 nm thick Pt film was determined to be 300 mJ/cm{sup 2}. Our experiments have shown that shorter irradiation times (≤60 s) produce smaller nanoparticles with more uniform sizes, while longer times (>60 s) give large nanoparticles with wider size distributions. The optimum laser irradiation time of 1 s (10 pulses) has led to the formation of highly ordered Pt nanoparticle arrays with an average nanoparticle size of 26 ± 3 nm with no substrate deformation. At the optimum condition of 1 s and 500 mJ/cm{sup 2}, as many as 85% of the dewetted NPs were found neatly in the well-defined dimples. This work has demonstrated that pulsed laser dewetting of Pt thin films on a pre-patterned dimpled substrate is an efficient and powerful technique to produce highly ordered Pt nanoparticle arrays. This method can thus be used to produce arrays of other high-melting-point metal nanoparticles for a range of applications, including electrocatalysis, functionalized nanomaterials, and analytical purposes.

OSTI ID:
22402467
Journal Information:
Applied Physics Letters, Vol. 106, Issue 20; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
Country of Publication:
United States
Language:
English