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Title: Interface stress development in the Cu/Ag nanostructured multilayered film during the tensile deformation

Cu/Ag nanostructured multilayered films (NMFs) with different stacking sequences were investigated by synchrotron X-ray diffraction during the tensile deformations for interface stress study. The lattice strains were carefully traced and the stress partition, which usually occurs in the multiphase bulk metallic materials during plastic deformations, was first quantitatively analyzed in the NMFs here. The interface stress of the Cu/Ag NMFs was carefully analyzed during the tensile deformation and the results revealed that the interface stress was along the loading direction and exhibited three-stage evolution. This tensile interface stress has a detrimental effect on the deformation, leading to the early fracture of the NMFs.
Authors:
; ; ;  [1] ; ;  [2] ; ; ;  [3] ;  [4]
  1. School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081 (China)
  2. Shanghai Synchrotron Radiation Facility, Shanghai Institute of Applied Physics, Chinese Academy of Science, Shanghai 201204 (China)
  3. State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083 (China)
  4. College of Sciences, Northeastern University, Shenyang 110004 (China)
Publication Date:
OSTI Identifier:
22402398
Resource Type:
Journal Article
Resource Relation:
Journal Name: Applied Physics Letters; Journal Volume: 105; Journal Issue: 22; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; COPPER; DEFORMATION; FILMS; GOLD; INTERFACES; LAYERS; NANOSTRUCTURES; STRAINS; STRESSES; X-RAY DIFFRACTION