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Title: Transition among failure modes of the bending system with a stiff film on a soft substrate

Growing interest is being attracted by stretchable and flexible electronics recently due to their attractive characteristics, commercial potentials, and engineering challenges. In comparison with the system on a macroscopic scale, different failure modes are observed in a system with a thin film bonded on an elastomeric substrate. Furthermore, the experimental observations reveal that failure modes occur in turn with the increasing of thickness ratio of the film to substrate. In this paper, theoretical analysis is performed on the failure mechanism in this system with the focus on transitions among these failure modes based on the theory of fracture mechanics. The present theoretical predictions are coincident with related experiment results and can be used to guide the related structural design.
Authors:
 [1] ;  [2] ; ; ;  [3] ;  [4] ;  [5]
  1. College of Mechanical Engineering, Yangzhou University, Yangzhou 225127 (China)
  2. (United Kingdom)
  3. AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084 (China)
  4. (China)
  5. LTCS and College of Engineering, Peking University, Beijing 100871 (China)
Publication Date:
OSTI Identifier:
22399096
Resource Type:
Journal Article
Resource Relation:
Journal Name: Applied Physics Letters; Journal Volume: 106; Journal Issue: 2; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; BENDING; COMPARATIVE EVALUATIONS; FAILURES; FRACTURE MECHANICS; SUBSTRATES; THICKNESS; THIN FILMS