Linking strain anisotropy and plasticity in copper metallization
- IBM T.J. Watson Research Center, Yorktown Heights, New York 10598 (United States)
- IBM Semiconductor Research, Albany, New York 12203 (United States)
The elastic anisotropy of copper leads to significant variation in the x-ray elastic constants (XEC), which link diffraction-based strain measurements to stress. An accurate depiction of the mechanical response in copper thin films requires a determination of an appropriate grain interaction model that lies between Voigt and Reuss limits. It is shown that the associated XEC weighting fraction, x*, between these limits provides a metric by which strain anisotropy can be quantified. Experimental values of x*, as determined by a linear regression scheme of diffraction data collected from multiple reflections, reveal the degree of strain anisotropy and its dependence on plastic deformation induced during in-situ and ex-situ thermal treatments.
- OSTI ID:
- 22398995
- Journal Information:
- Applied Physics Letters, Vol. 106, Issue 18; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
- Country of Publication:
- United States
- Language:
- English
Auxetic crystals under stress: Peering into their mechanics using x-rays
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journal | January 2019 |
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