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Title: Linking strain anisotropy and plasticity in copper metallization

The elastic anisotropy of copper leads to significant variation in the x-ray elastic constants (XEC), which link diffraction-based strain measurements to stress. An accurate depiction of the mechanical response in copper thin films requires a determination of an appropriate grain interaction model that lies between Voigt and Reuss limits. It is shown that the associated XEC weighting fraction, x*, between these limits provides a metric by which strain anisotropy can be quantified. Experimental values of x*, as determined by a linear regression scheme of diffraction data collected from multiple reflections, reveal the degree of strain anisotropy and its dependence on plastic deformation induced during in-situ and ex-situ thermal treatments.
Authors:
;  [1] ; ;  [2]
  1. IBM T.J. Watson Research Center, Yorktown Heights, New York 10598 (United States)
  2. IBM Semiconductor Research, Albany, New York 12203 (United States)
Publication Date:
OSTI Identifier:
22398995
Resource Type:
Journal Article
Resource Relation:
Journal Name: Applied Physics Letters; Journal Volume: 106; Journal Issue: 18; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; ANISOTROPY; COPPER; HEAT TREATMENTS; METRICS; PLASTICITY; REFLECTION; STRAINS; STRESSES; THIN FILMS; VARIATIONS; X-RAY DIFFRACTION