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Title: Estimating interfacial thermal conductivity in metamaterials through heat flux mapping

The variability of the thickness as well as the thermal conductivity of interfaces in composites may significantly influence thermal transport characteristics and the notion of a metamaterial as an effective medium. The consequent modulations of the heat flux passage are analytically and experimentally examined through a non-contact methodology using radiative imaging, on a model anisotropic thermal metamaterial. It was indicated that a lower Al layer/silver interfacial epoxy ratio of ∼25 compared to that of a Al layer/alumina interfacial epoxy (of ∼39) contributes to a smaller deviation of the heat flux bending angle.
Authors:
; ;  [1]
  1. Department of Mechanical and Aerospace Engineering, University of California, San Diego, La Jolla, California 92093 (United States)
Publication Date:
OSTI Identifier:
22398878
Resource Type:
Journal Article
Resource Relation:
Journal Name: Applied Physics Letters; Journal Volume: 106; Journal Issue: 14; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; ALUMINIUM; ALUMINIUM OXIDES; ANISOTROPY; BENDING; COMPARATIVE EVALUATIONS; EPOXIDES; HEAT FLUX; INTERFACES; LAYERS; MAPPING; METAMATERIALS; MODULATION; SILVER; THERMAL CONDUCTIVITY