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Title: Estimating interfacial thermal conductivity in metamaterials through heat flux mapping

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.4917344· OSTI ID:22398878

The variability of the thickness as well as the thermal conductivity of interfaces in composites may significantly influence thermal transport characteristics and the notion of a metamaterial as an effective medium. The consequent modulations of the heat flux passage are analytically and experimentally examined through a non-contact methodology using radiative imaging, on a model anisotropic thermal metamaterial. It was indicated that a lower Al layer/silver interfacial epoxy ratio of ∼25 compared to that of a Al layer/alumina interfacial epoxy (of ∼39) contributes to a smaller deviation of the heat flux bending angle.

OSTI ID:
22398878
Journal Information:
Applied Physics Letters, Vol. 106, Issue 14; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
Country of Publication:
United States
Language:
English